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The current status of LED lighting Heat Dissipation Technology

Time:2015-08-06 Views:2421 Compile:SUNPER

Use of LED lights has nowadays become a norm to most homeowners. There are many things one needs to know about LED lighting products. The LED light products have lighting limitation in terms of electrical energy. The concept of cooling technology is highly applied when converting electrical energy into light energy. Heat is designed to help during this process as well as to convert electrical energy into light energy. The following is the present status of LED lighting Heat Dissipation technology.

LED heat dissipation plus the main influencing factors

The main factors that affect thermal conductivity include packaging, chip size, packaging materials, chip as well as chip material based on the current density. Under the normal circumstances LED lighting products use chips, external radiators and circuit boards. Nowadays, there are two species of thermal design programme. There is the reduced LED device using power into heat which is achieved through improvement of the internal LED devices within quantum efficiency. There is also a surface from an external design by changing the LED devices as well as lamps of package way or package material. Sometimes it is necessary to configure the radiator so as to counter any temperature problem. This also helps in prolonging the lifespan of your LED products.

The concept of the cooling technology

Currently, for one to change the external LED lighting devices you need to use the radiator’s method so as to solve the heat problem. This is due to the technical limitations. In the process of cooling the LED lighting devices there are different kinds which can be divided into the lighting level as well as the package level cooling. In package level, it is optimizing the LED package materials and structure in order to reduce the effect of resistance of the package thermal. It is mainly divided into silicon substrate for the flip chip in the package structure, metal circuit board substrates and materials like selection principle of the paste material.

The lamp thermal way mainly refers to heat from the package base board to the external thermal device of a passed process during the implementation thermal way. It is divided into active thermal and passive thermal. Active thermal refers to the system of yiwai energy drive, LED internal chip and its devices of the heat distributed out. This mainly includes adding a loaded fan thermal, liquid cold thermal, semi-conductor refrigeration thermal and the ion wind thermal. The passive thermal refers to LED lighting spreading out the heat generated in the process only through a radiator. This is done so as to achieve a lower junction temperature effect mainly by use of a direct natural convection heat exchange tubes.

Selecting the right material for heat dissipation

The premise is usually encapsulated in a mode of heat structures that have been identified and thus it is easy to decide on the package to select the most suitable packaging materials. Packaging materials normally improve thermal performance thereby reducing the package resistance of the LED lighting products. This may eventually leads to the cooling effect of the system. Packaging materials can be divided into substrate materials and paste three materials. As far as the substrate material is concerned, the thermal requirements involved in LED lighting products are characterized by high stability, high electrical insulation, high thermal conductivity and the chip matched coefficients of thermal expansion. The most used substrate materials include silicon, metals like copper and aluminum as well as composite materials.

Liquid cooling

Liquid cooling is enhanced using a pump so as to force it flow through the surface of the radiator by use of heat dissipation capacity of cooling technology. The Etemaleds is firm in the United States of America that has launched cooling LED lights. It makes use of liquid in the process of cooling. This is very important because it ensures long lifespan of the device. The light radiation angle is 360 degrees.

Generally, liquid cooling is an active cooling and is done in the production processes. However, it is difficult and complex to achieve it. This process enables your devices to withstand vibrations, high temperatures and other harsh surrounding environments. Cooling is highly applied in the production processes to prevent LED device damages.

Above is everything about the current status of LED lighting heat dissipation technology. It is very crucial and hence need to know about it.

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